Semiconductor Packaging: Key to US Tech Leadership in AI, Says Cadence CEO

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According to Anirudh Devgan, CEO of Cadence Design Systems Inc (NASDAQ: CDNS), semiconductor packaging is the key to U.S. leadership in emerging technologies like artificial intelligence. While sophisticated chip packaging has helped companies like Nvidia Corp (NASDAQ: NVDA) develop AI accelerators, a limited number of suppliers are now causing bottlenecks. As computational demands increase and advanced chips become more expensive due to smaller transistors, working with three-dimensional structures and overcoming physical limitations is essential, Bloomberg reports. Taiwan Semiconductor Manuf…

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